TU-862 HF/TU-86P HF High Tg halogen free materials are made of epoxy resin and E-glass fabric. Unlike conventional FR-4 material using brominated resin as flame retardant, TU-862 HF/TU-86P HF achieves flammability class of UL94V-0 by incorporating phosphorous and nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-86P HF is designed for use with TU-862 HF for making multilayer printed wire boards. TU-862 HF is also available for single/double sided application. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-862 HF laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and CAF resistance.
Main Applications
Backpanel, High performance computing
Line cards, Storage
Servers, Telecom, Base station
Office Routers
Key Features
Low halogen and environmental friendly materials
Lead free process compatible
Compatible to PCB processes
Very low coefficient of thermal expansion
Moisture resistance
Anti-CAF capability
Higher Tg characteristics
Property | Typical Values |
Tg (DMA) | 200°C |
Tg (TMA) | 170°C |
Td (TGA) | 390°C |
CTE z-axis (50 to 260 °C) | 2.1% |
T-260/ T288 | >60 min/ >60 min |
Permittivity (RC 50%) @1GHz | 4.4 |
Loss Tangent (RC 50%) @1GHz | 0.010 |
Industry Approvals
IPC-4101 Type Designation: /127, /128, /130
IPC-4101E/130 Validation Services QPL Certified
UL Designation - ANSI Grade FR-4.1
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 5oz (HTE) for built-up & double sides and H to 2oz (MLS)
Prepregs: Available in roll or panel form
Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628, etc.
TU-862S High Tg halogen free Mid-loss material is made of high performance epoxy resin and regular woven E-glass fabric, designed with lower dielectric constant and dissipation factor for high speed mid-loss multilayer circuit server board applications. Unlike conventional FR-4.0 material using brominated resin as flame retardant. TU-862S achieves flammability class of UL94V-0 by incorporating phosphorus and nitrogen compounds in the materials. TU-862S material is suitable for environmental protection lead free process and also compatible with FR-4 processes. This green material is designed to achieve thermal robust, mid-loss signal attenuation and eliminate the use of potential hazardous halogenated resins.
Main Applications
Backpanel, High performance computing
Line cards, Storage
Servers, Telecom, Base station
Office Routers
Key Features
Lower Dk & Df performance, mid-loss applications
Lead free process compatible
Environmental friendly materials
Compatible to PCB processes
Low coefficient of thermal expansion
Moisture resistance
Anti-CAF capability
Property | Typical Values |
TG (DMA) | 200°C |
TG (TMA) | 165°C |
Td (TGA) | 370°C |
CTE z-axis (50 to 260 °C) | 2.2% |
T-260/ T288 | >60 min/ >60 min |
Permittivity (RC 50%) @1GHz | 4.3 |
Loss Tangent (RC 50%) @1GHz | 0.011 |
Industry Approvals
IPC-4101 Type Designation: /127, /128, /130
IPC-4101E/130 Validation Services QPL Certified
UL Designation - ANSI Grade FR-4.1
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 4 oz for built-up & double sides
Prepregs: Available in roll or panel form
Glass Styles: 106, 1080, 3313, 2116 etc and other prepreg grades are available upon request
TU-862T High Tg halogen free materials are made of High Tg epoxy resin and E-glass fabric. Unlike conventional FR-4 material using brominated resin as flame retardant, TU-862T /TU-862P T achieves flammability class of UL94V-0 by incorporating phosphorus and nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-862P T is designed for use with TU-862T for making multilayer printed wire boards. TU-862T is also available for single/double sided application. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-862T laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and CAF resistance than conventional High Tg materials.
Main Applications
Backplane, High performance computing
Automotive, Harsh environments
Servers, Telecom, Base station
Office Routers
Key Features
Low halogen and environmental friendly materials
Lead free process compatible
Compatible to PCB processes
Very low coefficient of thermal expansion
Moisture resistance
Anti-CAF capability
Higher Tg characteristics
Property | Typical Values |
TG (TMA) | 175°C |
Td (TGA) | 370°C |
CTE z-axis (50 to 260 °C) | 2.0% |
T-260/ T288 | >60 min/>60 min |
Permittivity (RC 50%) @1GHz | 4.5 |
Loss Tangent (RC 50%) @1GHz | 0.013 |
Industry Approvals
IPC-4101 Type Designation: /127, /128, /130
IPC-4101E/130 Validation Services QPL Certified
UL Designation - ANSI Grade FR-4.1
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Thickness: 0.002”[0.05mm] to 0.062” [1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 5 oz (HTE) for built-up & double sides and H to 2 oz (MLS)
Prepregs: Available in roll or panel form
Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628, etc.